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Apple Inc. has started to order components for its new generation of the iPhone, which is expected to hit markets worldwide in the coming third quarter, Sina Tech reported, citing people close to the matter.
According to Apple's suppliers, iPhone 5 will be thinner and lighter, with a more-advanced eight-megapixel camera. The new iPhone will operate on Qualcomm Inc.'s wireless chips, instead of the current chips made by Infineon Technologies AG, they said.
Apple plans to supply 25 million units of the iPhone 5 by the end of the year, while the initial production target was a few millions, said a source with one of Apple's suppliers. "We are told to supply components to Hon Hai Precision Co., which assembles the iPhone for Apple," said the source.
But another source said that the launch of iPhone 5 will be delayed if Hon Hai doesn't raise production. "The iPhone 5 is very complicated and difficult to assemble," the source said.
Hon Hai chairman Terry Guo said last month that his company will raise the production rate and volume in the second half of the year. |
知情人士透露，蘋果已經(jīng)開始為下一代iPhone手機(jī)訂購零部件，并計(jì)劃于今年第三季度推出iPhone 5，新浪科技周四引用知情人士消息報(bào)道。
來自蘋果零部件供應(yīng)商的消息稱，iPhone 5比iPhone 4更薄、更輕，采用800萬像素?cái)z像頭，無線基帶芯片將來自高通，而當(dāng)前的iPhone 4采用的是英飛凌的基帶芯片。
蘋果零部件供應(yīng)商的消息還稱：“蘋果計(jì)劃在年底前提供2500萬部iPhone 5，最初的產(chǎn)量目標(biāo)是數(shù)百萬部，我們被告知在8月份向組裝廠商鴻海精密提供零部件。”
但另有消息稱，如果鴻海精密不提高產(chǎn)量，很難滿足iPhone 5的出貨量目標(biāo)。該消息稱：“iPhone 5很復(fù)雜，組裝起來也困難。”
鴻海精密董事長郭臺銘上個(gè)月曾表示，計(jì)劃在今年下半年提升組裝能力。 |
